The xMEMS XMC-1200 is a solid-state micro fan developed for AR, XR and AI-powered smart glasses to improve thermal management within compact wearable devices. Measuring 46 square millimeters and 1 millimeter thick, the cooling module consumes 70 milliwatts of power while delivering up to a 10°C temperature reduction under a 1-watt thermal load. The fan is designed to operate with the company's Astra2 drive ASIC and is compact enough to fit inside the temple arms of smart glasses.
The cooling module carries an IP68 rating for resistance to dust and water, supporting use in a range of environmental conditions. xMEMS developed the component to provide active cooling for processors and other heat-generating electronics integrated into wearable devices. Engineering samples are currently available to qualified OEMs and technology partners under non-disclosure agreements as manufacturers evaluate the technology for future smart glasses and extended reality hardware.
Image Credit: xMEMS
Why This Trend Is Growing
- Solid-state Cooling
- Miniaturized fanless mechanisms are expanding thermal design options for dense electronics where traditional moving parts are too large, fragile, or inefficient.
- AI Wearable Thermals
- Rising on-device intelligence in smart glasses is creating demand for embedded heat control that preserves comfort, battery life, and processor performance.
- Rugged Micro Components
- IP-rated miniature modules are enabling wearable hardware to operate reliably across outdoor, fitness, industrial, and everyday consumer environments.
Industries Being Reshaped
- Smart Glasses
- Thermally optimized temple-arm components can support more powerful displays, sensors, and AI processors without compromising lightweight eyewear designs.
- Extended Reality
- Compact active cooling technologies are reducing constraints on XR hardware performance as immersive devices become smaller and more mobile.
- Semiconductors
- Specialized ASIC-driven micro systems are creating new component categories around power-efficient thermal management for next-generation edge devices.
