Lian Li's SP750 V2 and SP850 V2 PSUs Feature All Standard Connectors
Colin Smith — October 6, 2025 — Tech
References: lian-li & kitguru.net
The SP750 V2 and SP850 V2 are compact SFX power supplies from Lian Li offered in 750W and 850W ratings respectively, designed for space‑limited builds while supporting modern high‑power components; both units measure 125 × 100 × 63.5 mm, carry an 80 PLUS Gold efficiency rating, and comply with ATX 3.1 with native 12V‑2×6 (12V‑2×6) GPU power support in a fully modular form factor. The series incorporates an aluminum housing, fully modular cable set with an embossed anti‑tangle design, Japanese electrolytic capacitors for longevity, and a 92 mm FDB fan with a zero‑RPM mode intended to reduce acoustic output under light loads.
The SP V2 series includes comprehensive protection circuitry (OCP, OVP, SCP, OPP, UVP, OTP) and is backed by a 10‑year warranty, reflecting Lian Li’s positioning of the units for long‑term reliability in compact systems. Lian Li’s custom 12V‑2×6 cable is highlighted for improved durability and installation convenience, and third‑party reporting notes that the single supplied 12V‑2×6 connector is rated for up to 450 W continuous, a specification relevant for high‑end GPU configurations in SFX builds.
Image Credit: Lian Li
The SP V2 series includes comprehensive protection circuitry (OCP, OVP, SCP, OPP, UVP, OTP) and is backed by a 10‑year warranty, reflecting Lian Li’s positioning of the units for long‑term reliability in compact systems. Lian Li’s custom 12V‑2×6 cable is highlighted for improved durability and installation convenience, and third‑party reporting notes that the single supplied 12V‑2×6 connector is rated for up to 450 W continuous, a specification relevant for high‑end GPU configurations in SFX builds.
Image Credit: Lian Li
Trend Themes
1. Compact Power Supplies - Compact power supplies offer efficient energy solutions for space-constrained systems, promoting innovation in miniaturization and performance optimization.
2. Modular Design Components - Modular components enhance the flexibility and customization of computing systems, driving advancements in user-friendly assembly and maintenance.
3. Advanced Cooling Technologies - Advanced cooling solutions like zero-RPM modes reduce noise and heat, pushing the envelope in thermal management for compact electronics.
Industry Implications
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