Fabric8Labs and the University of Illinois introduced direct-to-chip (D2C) copper cold plates produced via Fabric8Labs’ electrochemical additive manufacturing (ECAM) process, featuring topology-optimized fin geometries designed specifically for liquid cooling of high-power chips. The collaboration published initial results in Cell Reports Physical Science and tested designs intended to reduce the power needed for thermal management.
Researchers used computational topology optimization to iterate fin shapes with pointed tops and jagged edges that conventional methods rarely produce, and Fabric8Labs’ ECAM enabled printing in pure copper rather than copper alloys. The project was supported by U.S. Department of Energy funding and follows Fabric8Labs’ recent growth and investment to scale U.S. manufacturing capacity.
For data centers, these cold plates promise higher cooling efficiency and lower pumping power, which can reduce operating costs and carbon footprint while addressing rising AI chip heat loads. The research demonstrates how additive manufacturing and design-driven cooling can shift thermal management toward more energy-efficient, scalable solutions.
Optimized Copper Cold Plates
Fabric8Labs & University of Illinois Introduced Thier D2C Cold Plates
Trend Themes
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Topology-optimized Cooling — Thermal designs with nontraditional fin geometries enable significantly higher heat-transfer efficiency for concentrated high-power chips.
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Electrochemical Additive Manufacturing — Pure-metal AM techniques permit fabrication of complex copper structures that were previously infeasible with subtractive or alloy-based processes.
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Direct-to-chip Cold Plates — Integration of D2C cold plates shifts thermal management from generic heat sinks toward bespoke, chip-specific liquid cooling interfaces.
Industry Implications
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Data Centers — Enhanced cooling efficiency and reduced pumping power have the potential to lower operational costs and carbon intensity for hyperscale compute facilities.
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Semiconductor Manufacturing — Chipmakers confronting escalating power densities could see packaging and thermal integration evolve to incorporate custom liquid-cooling hardware.
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Advanced Metal Additive Manufacturing — Service providers and equipment makers may need to support high-throughput ECAM of pure copper components with repeatable material and thermal performance.