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# Solid-State Heat Dissipation Units
'Phononic' Uses Thermoelectric Devices to Efficiently Move Heat

By Colin Smith | Published 2023-10-26 | Tech
Source: Trend Hunter, https://www.trendhunter.com/trends/phononic-hex-2
References: [phononic](https://phononic.com/support/hex/)

![Solid-State Heat Dissipation Units](https://cdn.trendhunterstatic.com/thumbs/518/phononic-hex-2.jpeg)

The 'Hex 2.0' CPU cooler from Phononic uses a solid-state thermoelectric module and a thermally-conductive heatsink to efficiently dissipate heat from a processor. The Hex 2.0 is compatible with [Intel](https://www.trendhunter.com/trends/lc-power-digi-aera) processors at this time, and can technically be used with [AMD](https://www.trendhunter.com/trends/polar-st5) processors, but it is not rated for efficiency with AMD processors.

This [solid-state thermoelectric cooler](https://www.trendhunter.com/trends/computer-cooling-systems) is easy to install and maintain due to its lack of moving parts. The cooler does not require a cooling fan or any liquid compound. However, its performance is dramatically increased when attaching a cooling fan, though this is not necessarily required for low-power processors, making this a reliable and cost-effective choice for compact low-power computing setups. According to Phononic, when paired with a cooling fan, the Hex 2.0 delivers far improved cooling efficiency when compared even to larger coolers due to the high thermal transfer rate from its solid-state module.

Image Credit: Phononic

## Trend Insights (Trend Hunter)

- Score: 2.1/10
- Popularity: 20% | Activity: 24% | Freshness: 19%
- Audience gender: 50% men, 50% women
- Primary generations: Millennial, Gen X
- Top markets: North America, South America, Europe, Asia, Africa

## Categories

[Trend Hunter](https://www.trendhunter.com/trends) > [Tech](https://www.trendhunter.com/tech) > [Computers](https://www.trendhunter.com/computers)

## Key Themes

### What Makes This Trend Stand Out

- **Solid-state Heat Dissipation:** The use of solid-state thermoelectric modules in heat dissipation units is a disruptive innovation opportunity, providing efficient and reliable cooling solutions without the need for moving parts or liquid compounds.
- **Compact Low-power Computing:** The development of compact low-power computing setups that can effectively dissipate heat using solid-state CPU coolers presents a disruptive innovation opportunity for the tech industry.
- **Efficient Cooling Solutions:** The integration of cooling fans with solid-state thermoelectric coolers offers an opportunity for disruptive innovation in the field of heat dissipation, providing improved cooling efficiency even in smaller form factors.

### Sectors Adopting This

- **Technology:** The technology industry could benefit from utilizing solid-state thermoelectric modules in heat dissipation units to enhance the cooling efficiency of computer processors.
- **Electronics:** The electronics industry has an opportunity to develop compact and efficient cooling solutions for low-power computing setups using solid-state CPU coolers.
- **Manufacturing:** The manufacturing industry can explore the production of solid-state heat dissipation units that integrate cooling fans, offering improved cooling efficiency for various applications.

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